Title :
Compliant probe substrates with two-material, air-clad, grating-in-waveguide optical I/O interconnects
Author :
Thacker, H. ; Mule, A. ; Villalaz, R. ; Gaylord, T. ; Meindl, J.
Author_Institution :
Microelectronics Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
A novel, high-density compliant probe substrate with electrical and optical probes is demonstrated. The primary purpose of this probe substrate is to provide a non-damaging, temporary interface between the device-under-test (DUT) and automated test equipment (ATE) during wafer-level testing. The probe substrate would find application for testing a full range of devices with electrical and optical I/O interconnects.
Keywords :
diffraction gratings; optical fabrication; optical interconnections; optical waveguides; automated test equipment; compliant probe substrates; device-under-test; wafer-level testing; waveguide optical I/O interconnects; Contacts; Etching; Gratings; High speed optical techniques; Microelectronics; Optical interconnections; Optical waveguides; Probes; Silicon; Testing;
Conference_Titel :
Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE
Conference_Location :
Rio Grande, Puerto Rico
Print_ISBN :
0-7803-8557-8
DOI :
10.1109/LEOS.2004.1363300
