Packaging efforts for inter- and intra-board level optical interconnects

A flexible optical waveguide film with integrated vertical-cavity surface-emitting laser (VCSEL) and positive-intrinsic-negative (PIN) photodiode arrays for fully embedded board level optical interconnects is demonstrated. The optical waveguide circuits with 45° micro-mirror couplers are fabricated on a thin flexible polymeric substrate by soft molding. 45° micro-mirrors on waveguide array for fully embedded board level optical interconnections are investigated both theoretically and experimentally. Smooth mirror surface fabrication is demonstrated by using microtome blade. Thin film VCSEL arrays and PIN photodiode arrays are directly integrated on to the waveguide film. Measured propagation loss of the waveguide was 0.3 dB/cm at 850 nm.