DocumentCode
2018348
Title
The design for an innovative semi-automatic die bonder
Author
Matthews, K. ; Cady, Ray ; Kelley, Mike ; Doig, Alan ; Sidebottom, Neil ; Knowles, Peter ; Sylvester, Joe ; Husted, Andy ; Albee, Paul ; Tan, Songsheng ; Hughes, Larry ; Thomas, John ; Booth, Dewey ; Miller, Bill
Volume
1
fYear
2004
fDate
7-11 Nov. 2004
Firstpage
445
Abstract
A semi-automated die bonder that nests and bond chips in has been fabricated. The design for the die bonder incorporates wafer-scale die bonding, small volume stack-up bonding, vacuum soldering and/or individual die bonding capabilities - which is unique to any die bonders or patents made/held to date.
Keywords
bonding processes; microassembling; soldering; wafer bonding; innovative semiautomatic die bonder; stack-up bonding; vacuum soldering; wafer-scale die bonding; Artificial intelligence; Assembly; Lead; Microassembly; Optical devices; Packaging; Silicon; Soldering; Substrates; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE
Print_ISBN
0-7803-8557-8
Type
conf
DOI
10.1109/LEOS.2004.1363303
Filename
1363303
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