DocumentCode
2018403
Title
Thermally conductive adhesives based on silver coated copper flake fillers
Author
Jin-Qi, Xie ; Hu-Ming, Ren ; Kai, Zhang ; Matthew M.F., Yuen ; S.W.Ricky, Lee ; Xian-Zhu, Fu ; Rong, Sun ; Ching-Ping, Wong
Author_Institution
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
294
Lastpage
296
Abstract
In this paper, we reported thermally conductive adhesives filled with Ag-coated Cu flakes and investigated the effect of adhesive composition on the thermal conductive performance. Results revealed that the thermal conductivity increased by increasing the content of Ag coated Cu filler and 16 W/mK can be obtained with 90 wt.% Ag coated Cu filler content.
Keywords
Conductive adhesives; Electronic packaging thermal management; ISO Standards; Packaging; Silver; Thermal conductivity; Ag coated Cu filler; thermal conductivity; thermally conductive adhesive; viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236595
Filename
7236595
Link To Document