Title :
Thermally conductive adhesives based on silver coated copper flake fillers
Author :
Jin-Qi, Xie ; Hu-Ming, Ren ; Kai, Zhang ; Matthew M.F., Yuen ; S.W.Ricky, Lee ; Xian-Zhu, Fu ; Rong, Sun ; Ching-Ping, Wong
Author_Institution :
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China
Abstract :
In this paper, we reported thermally conductive adhesives filled with Ag-coated Cu flakes and investigated the effect of adhesive composition on the thermal conductive performance. Results revealed that the thermal conductivity increased by increasing the content of Ag coated Cu filler and 16 W/mK can be obtained with 90 wt.% Ag coated Cu filler content.
Keywords :
Conductive adhesives; Electronic packaging thermal management; ISO Standards; Packaging; Silver; Thermal conductivity; Ag coated Cu filler; thermal conductivity; thermally conductive adhesive; viscosity;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236595
