DocumentCode
2018667
Title
Effect of SiCp particle size and anneal on properties of Al/SiC composites prepared by powder liquid -phase sintering
Author
Yilong Dai ; Fei Teng ; Kun Yu
Author_Institution
Sch. of Mater. Sci. & Eng., Central South Univ., Changsha, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
347
Lastpage
353
Abstract
Al-50wt.%SiC composites containing three types of SiC particle sizes(average23μm, 38μm and 75μm) were fabricated by powder liquid-phase sintering. The influences of SiC particle sizes and anneal on the properties were investigated in the study. The results show that the composites with coarse SiC particles can obtain higher thermal conductivity (TC), higher coefficient of thermal expansion(CTE) and higher relative density, while the composites with finer SiC particles are able to have lower CTE and enhance the flexural strength of the composites effectively. Besides, after the annealing at 500 °C for 6 hours, the shape and size of SiC particles in the annealed composites are not changed nearly, compared with those in the sintered composites. In addition, the CTE and flexural strength of the annealed composites are decreased, and the TC is improved a little. From the results obtained, it is credible that Al-50wt.%SiC composites can possess good potential for electronic packaging application.
Keywords
annealing; bending strength; particle reinforced composites; particle size; powder technology; sintering; thermal conductivity; thermal expansion; AI-SiC composites; SiC particle size effect; SiC-Al; annealing; coarse particles; electronic packaging application; flexural strength; powder liquid-phase sintering; sintered composites; size 23 mum; size 38 mum; size 75 mum; temperature 500 degC; thermal conductivity; thermal expansion coefficient; time 6 hour; Annealing; Artificial intelligence; Electronics packaging; Liquids; Microstructure; Powders; Silicon carbide; Al-50wt.%SiC composite; electronic packaging; flexural strength; powder liquid-phase sintering; thermal properties;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha
Type
conf
DOI
10.1109/ICEPT.2015.7236606
Filename
7236606
Link To Document