High speed packaging technologies for 10 gigabit Ethernet applications

Author

Liu, Yung-Sheng ; Chu, Mu-Tao ; Chu, Yen ; Lee, Shin-Ge

Author_Institution

Opto-Electron. & Syst. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan

Volume

2

fYear

2004

fDate

7-11 Nov. 2004

Firstpage

511

Abstract

With the fast expansion of Internet usage, the demand of 10 Gb/s transmission optoelectronic devices for local-area-network (LAN) and storage-area-network (SAN) is increasing. The key issues of these applications are to improve the cost, manufacturability, and reliability of optoelectronic devices in high speed access transmission. The authors demonstrate a low cost, highly manufacturable and thermally stable mini-flat transmitter and TO-Can optical sub-assembly for 10 Gb/s Ethernet applications.

Keywords

assembling; optical fibre LAN; optical transmitters; optoelectronic devices; packaging; reliability; storage area networks; thermal stability; 10 Gbit/s; 10-Gb/s transmission optoelectronic devices; 10-gigabit Ethernet applications; TO-Can optical sub-assembly; cost improvement; high speed access transmission; high speed packaging; local-area-network; manufacturability; miniflat transmitter; reliability; storage-area-network; thermal stability; Costs; Ethernet networks; High speed optical techniques; Internet; Local area networks; Manufacturing; Optical transmitters; Optoelectronic devices; Packaging; Storage area networks;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE

Print_ISBN

0-7803-8557-8

Type

conf

DOI

10.1109/LEOS.2004.1363337

Filename

1363337