DocumentCode
2019214
Title
Effects of packaging design on the performance of TWEAM module for digital and analog applications
Author
Choi, Kwang-Seong ; Lee, John-Hyun ; Lim, Jiyoun ; Kang, Young-Shik ; Chung, Yong-Duck ; Moon, Jong-Tae ; Kim, Jeha
Author_Institution
Basic Res. Lab., Electron. & Telecommun. Res. Inst., Daejeon, South Korea
Volume
2
fYear
2004
fDate
7-11 Nov. 2004
Firstpage
515
Abstract
With optimized packaging design, 40 Gbps broadband TWEAM module and 40 GHz band TWEAM module were developed. The packaging technology included resonance suppression in broadband and impedance matching at 40 GHz in narrowband.
Keywords
electro-optical modulation; electroabsorption; electrodes; integrated optoelectronics; modules; packaging; 40 GHz; 40 Gbit/s; RFf transmission systems; TWEAM module; WDM; analog applications; broadband matching; broadband module; digital applications; electroabsorption modulator; impedance matching; narrowband module; packaging design; resonance suppression; travelling wave electrode; Coplanar waveguides; Digital modulation; Electrodes; Electronics packaging; Frequency response; Impedance matching; Optical modulation; Radio frequency; Resonance; Wavelength division multiplexing;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE
Print_ISBN
0-7803-8557-8
Type
conf
DOI
10.1109/LEOS.2004.1363339
Filename
1363339
Link To Document