DocumentCode :
2019861
Title :
Stretchable copper wires based on reduction of active metallic nanoparticles and electroplating
Author :
Zou, Peichao ; Liu, Jingping ; Yang, Cheng
Author_Institution :
Division of Energy & Environment, Graduate School at Shenzhen, Tsinghua University, Xili University Town, Nanshan, Shenzhen City, China, 518055
fYear :
2015
fDate :
11-14 Aug. 2015
Firstpage :
550
Lastpage :
554
Abstract :
Herein we proposed a novel technique in fabricating stretchable copper conductive circuits combining galvanic replacement with Zn-based active paste and electroplating process on elastomeric substrates. The conductive patterns exhibited excellent electrical conductivity and strechability. An active precursor paste composed of zinc nanoparticles and thermal-curable polyurethane resin were used, which was aimed to render the formation of copper layer as the conductive materials by a galvanic replacement reaction. Additionally, electroplating process was employed, with which the as-formed copper layer can be further thickened to improve the electrical conductivity. With this method, a maximal longitudinal tensile elongation of 38.4% was achieved for the wires with negligible conductivity loss. In summary, the flexible copper-based conductive circuits with excellent performances were produced in a cost-effective way. This technology will be a promising candidate for future stretchable electronic applications.
Keywords :
Copper; Thermal conductivity; copper; electroplating; galvanic replacement; stretchable circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
Type :
conf
DOI :
10.1109/ICEPT.2015.7236647
Filename :
7236647
Link To Document :
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