• DocumentCode
    2020090
  • Title

    Wafer-level packaging of optoelectronic chips using sea of leads electrical and optical I/O interconnections

  • Author

    Bakir, Muhannad S. ; Meindl, James D.

  • Author_Institution
    Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    7-11 Nov. 2004
  • Firstpage
    583
  • Abstract
    This paper describes sea of leads (SoL), its processing, its process integration with optoelectronic devices, and its optical, electrical, and mechanical characteristics.
  • Keywords
    integrated optoelectronics; optical interconnections; packaging; I/O interconnections; SoL processing; electrical characteristics; electrical interconnections; mechanical characteristics; optical characteristics; optical interconnections; optoelectronic chips; optoelectronic devices; process integration; sea of leads; wafer-level packaging; Assembly; Bandwidth; Mirrors; Optical coupling; Optical devices; Optical films; Optical interconnections; Optical polymers; Packaging; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE
  • Print_ISBN
    0-7803-8557-8
  • Type

    conf

  • DOI
    10.1109/LEOS.2004.1363373
  • Filename
    1363373
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2020090