Thermal performance and reliability management for novel power electronic packaging using integrated base plate

Due to the mismatch of coefficient of thermal expansion (CTE) among different structure material, warpage and stress would be generated in the module and then influence the reliability and long term usage. This paper investigate a novel power electronic packaging design using integrated base plate (IBP). Module structure and assembly process of IBP-module have been introduced. The thermal and mechanical performance of the IBP-module during reflow process and operating process compared with typical power modules have been studied by the approach of finite element methods, where the Anand constitutive model has been used to describe the time-dependent viscoplastic behavior of soft solder materials. The temperature distribution of modules during operation has been presented. It can be seen that the thermal performance of IBP-module has been improved a lot due to the decrease of thermal resistance. Warpage and stress analysis of novel after reflow process caused by CTE mismatch have been conducted to show the advantage of novel packaging style. Finally, virtual reliability results of thermal cycling swung from −55 °C to 150 °C and the corresponding failure analysis based on IBP structure have been discussed to reveal the advantage in higher reliability of the novel packaging.