Title :
Development of TSV-based inductors in power electronics packaging
Author :
Mondal, Saikat ; Gamboa, Jonathan ; Kim, Bruce
Author_Institution :
Department of Electrical Engineering, City University of New York, USA
Abstract :
This paper describes the design of a Through-Silicon-Via (TSV) based high-density 3D toroidal type inductor with two different ferromagnetic materials (nickel and Ni-Zn-ferrite) in the core. 3D inductors with different structural dimensions are simulated and compared.
Keywords :
Filtering theory; Inductors; Magnetic separation; Packaging; Through-silicon vias; Toroidal magnetic fields; Power electronics; TSV; ferromagnetic material; inductor; nickel;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236663
