Title :
Safety Considerations for Liquid Filled Heat Sinks
Author_Institution :
DELL Inc., Round Rock
Abstract :
The basis for applying safeguard requirements to Information Technology Equipment (ITE) containing liquids is the requirement in sub-clause 4.3.10 of I EC 60950-1. It provide very general guidelines and do not completely specify the required safeguards and safeguard requirements. We need to look into other standards which address equipment that use pressurized and non-pressurized liquid containment vessels and address compatibility issues when plastic materials are used in conjunction with liquids. Product sizes are continuously being reduced and integrated circuit (IC) chips are becoming more compact containing more and more components. They are also going up in processing speeds. Products that try to keep up with new technology need more power and as a result, generate more heat in the equipment. This heat must be moved out of the product. There are many different types of systems available for cooling (moving heat out of the product). We are going to discuss mainly two types of liquid cooling systems here: liquid cooling heat pipes and liquid filled heat sink system.
Keywords :
IEC standards; cooling; heat pipes; heat sinks; compatibility issues; integrated circuit chips; liquid cooling heat pipes; liquid filled heat sink system; liquid filled heat sinks; nonpressurized liquid containment vessels; plastic materials; pressurized liquid cotainment vessels; safety considerations; Cooling; Gases; Heat sinks; Heat transfer; IEC standards; Liquids; Material storage; Safety; Temperature; Testing;
Conference_Titel :
Product Compliance Engineering, 2007. PSES 2007. IEEE Symposium on
Conference_Location :
Longmont, CO
Print_ISBN :
978-1-4244-1072-9
Electronic_ISBN :
978-1-4244-1072-9
DOI :
10.1109/PSES.2007.4378475