• DocumentCode
    2020573
  • Title

    Classification and 3D stack of Embedded Components technology in Substrate

  • Author

    Yang, Zhicheng ; Gunawan, Ferlee ; Gu, Xin ; Ding, Kunpeng ; He, Hao

  • Author_Institution
    Shennan Circuits Co., Ltd, Gao Qiao Industrial Park East, Long Gang District, Shenzhen 518117, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    666
  • Lastpage
    671
  • Abstract
    Recently, Embedded Components in Substrates (ECiS) technology has been developed with many technologies. Some of these technologies are very mature and compatible for any conventional processes of PCB/Substrate manufacturing which need to be supported by SMT processes. Nowadays, some of electronic products with ECiS technologies already got high volume production scale. As frontline, this paper will describe about the classification of these ECiS technologies.
  • Keywords
    Fabrication; Reliability; Stacking; Substrates; 3D Stack technology; Advanced packaging technology; Embedded Components in Substrate; SiP;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236674
  • Filename
    7236674
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2020573