Title :
The numerical investigation on the stiffness of CuCGA interconnection under the condition of shearing
Author :
Zhao, Zhili ; Liu, Yingjie ; Yang, Jianguo ; Dai, Wenqin
Author_Institution :
Harbin University of Science and Technology, School of Materials Science & Engineering, China
Abstract :
In this paper, the effect of the number and the spacing for copper columns to the copper column grid array (CuCGA) interconnection structure under the condition of shearing load was discussed by the means of nonlinear finite element method (FEM). The results as follows: Shear force increases significantly with the increase of shear displacement in the process of shearing, and according to the variation of the slope for curve of shear force-shear displacement, the curve can be divided into 3 stages before fracture occurring; With the increase of the number of copper columns, the slope for curve of shear force-shear displacement increase, which means the stiffness of the CuCGA interconnection structure increases with the increase of the number of copper columns. And with the increase of spacing for copper columns, the stiffness of CuCGA interconnection structure increase.
Keywords :
Arrays; Bonding; Copper; Finite element analysis; Force; Shearing; Strain; CuCGA; number of copper columns; shear force; spacing of copper columns;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236678