A multipole-accelerated boundary-element approach to transient simulations of three-dimensional integrated circuit interconnect

It has recently been shown that accurate electro-quasistatic, or transient interconnect, analysis for three-dimensional structures can be performed using the same surface discretization used for ordinary capacitance extraction. In this paper we describe how to use multipole-accelerated, iterative algorithms to reduce the computational complexity of surface-discretization based transient interconnect analysis from order N³ to order N, where N is the number of surface unknowns