DocumentCode
2020985
Title
Prediction of TEC power consumption for cooled laser diode module
Author
Lee, Jong Jin ; Kang, Hyun Seo ; Koh, Jai Sang
Author_Institution
ETRI, Optical Components Res. Center, Gwangju, South Korea
Volume
2
fYear
2004
fDate
7-11 Nov. 2004
Firstpage
657
Abstract
In this study, the power consumption of TEC (thermoelectric cooler) is predicted using 3-D thermal FEM simulation and compared with experimental result. In addition to that, the effect of TEC configuration defined with the dimension and the number of pellets is discussed using commercialized product (RMT 1ML06-035-09AN) and its database to investigate the size effect. Results show that the cooling capacity of the TEC increases with increasing TEC pellet number. The power consumption of the module which the LD chip operates at 40 °C dramatically decreases with power consumption equal to 1/3 of the laser diode module operating at 25 °C.
Keywords
cooling; finite element analysis; modules; power consumption; semiconductor lasers; thermoelectric devices; thermoelectricity; 25 degC; 3-D thermal FEM simulation; 40 degC; RMT 1ML06-035-09AN; TEC power consumption; cooled laser diode module; cooling capacity; size effect; thermoelectric cooler; Cooling; Diode lasers; Energy consumption; Heat transfer; Heating; Packaging; Power generation; Temperature sensors; Thermal factors; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE
Print_ISBN
0-7803-8557-8
Type
conf
DOI
10.1109/LEOS.2004.1363410
Filename
1363410
Link To Document