• DocumentCode
    2020985
  • Title

    Prediction of TEC power consumption for cooled laser diode module

  • Author

    Lee, Jong Jin ; Kang, Hyun Seo ; Koh, Jai Sang

  • Author_Institution
    ETRI, Optical Components Res. Center, Gwangju, South Korea
  • Volume
    2
  • fYear
    2004
  • fDate
    7-11 Nov. 2004
  • Firstpage
    657
  • Abstract
    In this study, the power consumption of TEC (thermoelectric cooler) is predicted using 3-D thermal FEM simulation and compared with experimental result. In addition to that, the effect of TEC configuration defined with the dimension and the number of pellets is discussed using commercialized product (RMT 1ML06-035-09AN) and its database to investigate the size effect. Results show that the cooling capacity of the TEC increases with increasing TEC pellet number. The power consumption of the module which the LD chip operates at 40 °C dramatically decreases with power consumption equal to 1/3 of the laser diode module operating at 25 °C.
  • Keywords
    cooling; finite element analysis; modules; power consumption; semiconductor lasers; thermoelectric devices; thermoelectricity; 25 degC; 3-D thermal FEM simulation; 40 degC; RMT 1ML06-035-09AN; TEC power consumption; cooled laser diode module; cooling capacity; size effect; thermoelectric cooler; Cooling; Diode lasers; Energy consumption; Heat transfer; Heating; Packaging; Power generation; Temperature sensors; Thermal factors; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE
  • Print_ISBN
    0-7803-8557-8
  • Type

    conf

  • DOI
    10.1109/LEOS.2004.1363410
  • Filename
    1363410