Effects of Cu orientation on the microstructure of Sn-2Ag-2.5Zn /Cu interface

Author

Penghui Xu ; Fengtian Hu ; Anmin Hu ; Ming Li

Author_Institution

Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China

fYear

2015

fDate

11-14 Aug. 2015

Firstpage

789

Lastpage

792

Abstract

The effects of Cu orientation on the microstructure and growth of IMCs in Sn-2Ag-2.5Zn /Cu solder joints were studied. After reflowing at 250 °C for 10 s, the continuous scallop-like IMCs Cu₆Sn₅ in Sn-2Ag-2.5Zn /polycrystalline Cu solder joint were more flat and thinner than that on (110), (111) oriented Cu substrates. The grain size of IMC on single crystal Cu substrates was larger than that of IMC on polycrystalline Cu. While during aging time, the growth rate of IMC on polycrystalline Cu substrates was slower, compared with that on (110), (111) oriented Cu substrates, and the thickness of IMC on (110), (111) oriented Cu substrates showed no visible differences, It was observed that the thickness of IMC was proportional to the square of the time in aging process.

Keywords

ageing; copper; grain size; reflow soldering; silver alloys; solders; tin alloys; zinc alloys; SnAgZn-Cu; aging time; copper orientation; grain size; microstructure; reflowing; solder joints; temperature 250 degC; time 10 s; Aging; Lead; IMC; interfacial reaction; orientation;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2015 16th International Conference on

Conference_Location

Changsha

Type

conf

DOI

10.1109/ICEPT.2015.7236700

Filename

7236700