Title :
A review about the filling of TSV
Author :
Chen, Tao ; Sun, Jiadong ; Yan, Riming
Author_Institution :
State Key Laboratory of High Performance Complex Manufacturing, College of Mechanical and Electrical Engineering, Central South University, Changsha, China
Abstract :
3D integration with TSV is considered to be the development trend of the electronics packaging industry. It can meet the demand of high integration density, high performance and so on. The latest research can be divided into two directions to achieve a high-speed via filling without defect. One is about the process research and optimization of copper electroplating, which addresses the current density, additives and other factors. Another is about exploration of novel filling method. All the studies are aimed to achieve a robust filling result effectively. The recent studies and latest developments of TSV filling is reviewed in this paper.
Keywords :
Acceleration; Commercialization; Copper; Filling; Plating; Three-dimensional displays; TSV; copper electroplating; novel filling methods;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236716
