Wafer-level optical packaging for chip-scale atomic magnetometers

A wafer-level optical package solution for chip-scale atomic magnetometers is presented, which is based on microelectronic fabrication process on a 4 inch wafer. A module is fabricated following the process. By measuring the intensity of the light, it is indicated that the quality of parallelism and polarizability of the laser beam from a Vertical Cavity Surface Emitting Laser (VCSEL) in the module are acceptable. The frequency of the VCSEL is locked to D1 line of Rubidium through proper adjustment of temperature and driving current. The module is employed in an atomic magnetometer which operates in Mz configuration for the detection the strength of magnetic fields. Results show the feasibility of the package in a magnetometer system.