• DocumentCode
    2022258
  • Title

    Effect of the various doping concentration of BF2+ on polysilicon-gate PMOS

  • Author

    Aziz A, Abdul ; Zamani, N.S.

  • Author_Institution
    Fac. of Electr. Eng., Univ. Teknol. MARA, Shah Alam, Malaysia
  • fYear
    2009
  • fDate
    16-18 Nov. 2009
  • Firstpage
    222
  • Lastpage
    225
  • Abstract
    This paper presents the effect of various doping concentration of BF2 +polysilicon from 1011 to 1020 (atoms/cm3) for PMOS device using SILVACO TCAD (Technology Computer Aided Design) software. The threshold voltage of polysilicon obtain from ID-VGS curve was analyzed. The results show that BF2 + at dose 1014 to 1019 (atoms/cm3) giving the better characteristics of the PMOS at the threshold voltage between 1.0V to 1.3V. The resistivity of the polysilicon is gradually decreased as a concentration of doping increase, while the conductivity is reciprocal of the resistivity. The resistivity of polysilicon varies considerably depending upon the requirement in PMOS applications. To determine the better doping, the leakage current can be extracted from the I-V curve.
  • Keywords
    MOSFET; boron compounds; leakage currents; semiconductor device models; semiconductor doping; silicon; technology CAD (electronics); BF2+polysilicon; I-V curve; ID-VGS; SILVACO TCAD; Technology Computer Aided Design software; doping concentration; leakage current; polysilicon-gate PMOS; threshold voltage; Application software; Conductivity; Doping; Impurities; Integrated circuit technology; Leakage current; MOS devices; MOSFETs; Substrates; Threshold voltage; Conductivity; Doping concentration; Polysilicon; Resistivity; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Research and Development (SCOReD), 2009 IEEE Student Conference on
  • Conference_Location
    UPM Serdang
  • Print_ISBN
    978-1-4244-5186-9
  • Electronic_ISBN
    978-1-4244-5187-6
  • Type

    conf

  • DOI
    10.1109/SCORED.2009.5443098
  • Filename
    5443098