DocumentCode
2022386
Title
An overview of microwave component requirements for future space applications
Author
Barnes, A.R. ; Boetti, A. ; Marchand, L. ; Hopkins, J.
Author_Institution
Dept. of Product Assurance & Safety, Eur. Space Agency, Noordwijk, Netherlands
fYear
2005
fDate
3-4 Oct. 2005
Firstpage
5
Lastpage
12
Abstract
New and emerging microwave component developments and their potential impact upon payload implementation for future European Space Agency (ESA) missions are discussed. Consideration is given to the use of indium antimonide (InSb), gallium nitride (GaN), RF CMOS along with MEMS and advanced packaging techniques.
Keywords
CMOS integrated circuits; III-V semiconductors; gallium compounds; indium compounds; microwave devices; packaging; radiofrequency integrated circuits; satellite communication; wide band gap semiconductors; ESA missions; European Space Agency missions; GaN; InSb; MEMS; RF CMOS; advanced packaging techniques; gallium nitride; indium antimonide; microwave component requirements; space applications; Artificial satellites; Downlink; Frequency; Gallium nitride; Geoscience; Payloads; Satellite broadcasting; Space missions; Space technology; Transponders;
fLanguage
English
Publisher
ieee
Conference_Titel
Gallium Arsenide and Other Semiconductor Application Symposium, 2005. EGAAS 2005. European
Conference_Location
Paris
Print_ISBN
88-902012-0-7
Type
conf
Filename
1637140
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