DocumentCode
2022411
Title
A method for the radiated emission test of IC modules
Author
Lingling, Yang ; Haiyan, Sun ; Ling, Sun ; Shenlong, Wang ; Boyuan, Zhu ; Junwei, Lu
Author_Institution
Xinlin College, Nantong University, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
972
Lastpage
974
Abstract
A test method for evaluating the radiated emission of IC modules is presented in this paper and a radiated emission test platform based on TEM cell is built. The whole test process includes the verification of test platform and the designed testing PCB, the MCU radiated emission testing under the different working conditions. Thus, the method introduced in this paper is helpful to make a reasonable choice of the suitable MCU module for system application.
Keywords
Electromagnetic compatibility; Electronics packaging; Frequency measurement; IEC Standards; Integrated circuits; TEM cells; Transmission line measurements; QFP package; TEM cell; radiated emission;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236741
Filename
7236741
Link To Document