DocumentCode
2022530
Title
Effects of heatsink on the performance of high power semiconductor lasers
Author
Liming He ; Chuzhong Zhao ; Wenbin Liu ; Shujuan Wu ; Bocang Qiu ; Hu, Martin ; Yan Liu
Author_Institution
Shenzhen Raybow Optoelectron. Corp, Shenzhen, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
997
Lastpage
1000
Abstract
we report on our investigation of the impacts of different thermal configurations of chip-on-submounts (COS) on the performance of high power semiconductor lasers. Two types of submounts are studied; one is AlN sub-mount, and the other is AlN submount with both top and bottom surfaces being coated with thick copper layers. Both theoretical analysis and experiments are performed. Our results show COS with AlN submount coated with thick copper layers has improved thermal and laser performance.
Keywords
III-V semiconductors; aluminium compounds; heat sinks; semiconductor lasers; thermal management (packaging); AlN; AlN submount; COS; Cu; chip-on-submounts; heatsink; high-power semiconductor lasers; thermal configurations; thick copper layers; Aluminum nitride; Copper; Electronic packaging thermal management; Heating; III-V semiconductor materials; Temperature measurement; Thermal resistance; FEA; High power diode laser; Thermal management; heatsink;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha
Type
conf
DOI
10.1109/ICEPT.2015.7236747
Filename
7236747
Link To Document