Title :
Experimental study of chip offset on the packaging consistency of high power light-emitting diodes
Author :
Xie, Bin ; Chen, Qi ; Yu, Xingjian ; Shang, Bofeng ; Huang, Mengyu ; Luo, Xiaobing
Author_Institution :
School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, China
Abstract :
In this study, we experimentally investigated the effect of chip offset on the packaging consistency of high power LED. A series of LED modules with different chip offset distances and phosphor mass concentration were packaged, and two comparative experiments were conducted. Compared with the conventional modules, the maximum CCT deviation of off-centered modules increased from 128K to 667K. The results show that chip offset contributes significantly to the consistency of LED packaging.
Keywords :
Coatings; Color; Lead; Light emitting diodes; Lighting; Packaging; Phosphors; chip offset; correlated color temperature; light-emitting diodes; packaging consistency;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236763
