Title :
Thermal modeling and optimization for electronic packages
Author :
Wang, Zhifeng ; Sun, Haiyan ; Sun, Ling ; Wang, Xuemin ; Yang, Lingling
Author_Institution :
Jiangsu Key Laboratory of ASIC Design, Nantong University, No.9 Seyuan road, 226019, China
Abstract :
QFP (Quad Flat Package) has been widely used in modern electronic packages and its reliability has been paid a lot of attention. A general thermal resistance network of QFP is presented in this paper and the total thermal resistance has been estimated. A 3D model of the QFP-48 has been established and the thermal simulation has been done in ANSYS software. The equivalent total thermal resistance has been calculated according to the simulated results and compared with the estimated value at the same time. Some methods about thermal optimization for QFP package have been put forward and verified. The conclusions presented here are expected to provide the thermal design guidelines for QFP package.
Keywords :
Conductivity; Electronics packaging; Plastics; Resistance heating; Thermal conductivity; Thermal resistance; QFP; thermal resistance; thermal simulation;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236769
