DocumentCode
2023427
Title
Reliability analysis of and experiment test on SAC305 solder balls
Author
Tian, Wenchao ; Wei, Sanjuan
Author_Institution
School of Electro-Mechanical Engineering, Xidian University, Xi´an, 710071, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
1134
Lastpage
1138
Abstract
The thermal cycle analysis of the module on the basis of physical electronic packaging is researched in this paper, and the stress-strain hysteresis curve and the life of dangerous SAC305 lead-free solder balls are analyzed as the screw positions change. The related experiment is performed, and the results show that when the screw position is near to the chip, the life of SAC305 is longer, while it is farther, the life is shorter, which are in good agreement with the simulation results.
Keywords
Fasteners; Lead; Packaging; Reliability; Temperature measurement; Upper bound; Voltage measurement; SAC305; reliability life; screw preloaded locations; thermal cycle;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236780
Filename
7236780
Link To Document