Title :
Integration aspects of RF-MEMS technologies
Author :
Lisec, T. ; Wagner, B.
Author_Institution :
Fraunhofer Inst. for Silicon Technol., Germany
Abstract :
This paper presents an overview about existing fabrication and packaging solutions for RF MEMS switches with regard to integration with other passive or active devices. Achievements and problems are discussed from a technological point of view.
Keywords :
microswitches; RF MEMS switches; fabrication solutions; packaging solutions; Biomembranes; Dielectric substrates; Fabrication; Microswitches; Radio frequency; Radiofrequency microelectromechanical systems; Semiconductor device packaging; Switches; Switching circuits; Varactors;
Conference_Titel :
Gallium Arsenide and Other Semiconductor Application Symposium, 2005. EGAAS 2005. European
Conference_Location :
Paris
Print_ISBN :
88-902012-0-7
