• DocumentCode
    2024063
  • Title

    Development of ultra thin plate-type heat pipe with less than 1 mm thickness

  • Author

    Aoki, Hidetaka ; Shioya, Nobuyoshi ; Ikeda, Makoto ; Kimura, Yuichi

  • Author_Institution
    Furukawa Electr. Co., Ltd., Hiratsuka, Japan
  • fYear
    2010
  • fDate
    21-25 Feb. 2010
  • Firstpage
    217
  • Lastpage
    222
  • Abstract
    Authors are reporting development of ultra thin heat pipe and its performance. The ultra thin heat pipe has thickness less than 1.0 mm and high capability of maximum heat transfer capacity, so that this heat pipe can be installed for narrow space, in which it have been difficult to apply the plate heat pipe so far, of the ultra compact information equipment such as Net Book PC. In this ultra thin heat pipe, the mesh wick which was conducted oxidation-reduction process in high temperature was used in order to obtain sufficient capillary pressure for circulation of the working fluid. The ultra thin heat pipe consists of this mesh wick and the copper container which has thin wall. This structure ensures both sufficient capillary pressure and space of vapor flow. Two kinds of the ultra thin heat pipe were made; one was 1.0 mm thickness and the other was 0.7 mm thickness. These heat pipes had high maximum heat transfer capacity comparing with conventional groove heat pipe. In this paper, we proposed the ultra thin heat pipe which consists of high capillary pressure wick, and experimental investigation is discussed.
  • Keywords
    capillarity; heat pipes; heat transfer; thermal management (packaging); high capillary pressure wick; maximum heat transfer capacity; mesh wick; oxidation-reduction process; ultra compact information equipment; ultra thin plate type heat pipe; vapor flow; working fluid circulation; Containers; Copper; Heat transfer; Resistance heating; Space heating; Temperature; Thermal force; Thermal loading; Thermal resistance; Water heating; Capillary Force Limit; Capillary Pressure; Maximum Heat Transfer Capacity; Mesh Wick Structure; Pressure Drop; Thermal Resistance; Thin Heat Pipe;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-9458-3
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2010.5444289
  • Filename
    5444289