• DocumentCode
    2024153
  • Title

    Exploring the thermal impact on manycore processor performance

  • Author

    Wei Huang ; Skadron, Kevin ; Gurumurthi, Sudhanva ; Ribando, Robert J ; Stan, M.R.

  • Author_Institution
    Dept. of Comput. Sci., Univ. of Virginia, Charlottesville, VA, USA
  • fYear
    2010
  • fDate
    21-25 Feb. 2010
  • Firstpage
    191
  • Lastpage
    197
  • Abstract
    Performance of processors with many simple parallel cores is limited by the serial part of the workload, requiring an asymmetric core organization with one or more aggressive “primary” cores for better serial performance. A primary core introduces power-hungry microarchitectural structures and usually causes severe local hot spots. This paper explores the thermal impact on manycore processor architecture and evaluates its performance. Preliminary results show that thermal constraints reduce performance as expected, but also make performance almost insensitive to the complexity of the primary core across a diverse degrees of parallelism, which greatly reduces design complexity.
  • Keywords
    processor scheduling; thermal management (packaging); manycore processor performance; thermal constraint; thermal impact; CMOS technology; Computer architecture; Computer science; Liquid cooling; Microchannel; Microprocessors; Moore´s Law; Parallel processing; Silicon; Transistors; Thermal impact; manycore; performance; processors; thermal constraint;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-9458-3
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2010.5444293
  • Filename
    5444293