DocumentCode
2024153
Title
Exploring the thermal impact on manycore processor performance
Author
Wei Huang ; Skadron, Kevin ; Gurumurthi, Sudhanva ; Ribando, Robert J ; Stan, M.R.
Author_Institution
Dept. of Comput. Sci., Univ. of Virginia, Charlottesville, VA, USA
fYear
2010
fDate
21-25 Feb. 2010
Firstpage
191
Lastpage
197
Abstract
Performance of processors with many simple parallel cores is limited by the serial part of the workload, requiring an asymmetric core organization with one or more aggressive “primary” cores for better serial performance. A primary core introduces power-hungry microarchitectural structures and usually causes severe local hot spots. This paper explores the thermal impact on manycore processor architecture and evaluates its performance. Preliminary results show that thermal constraints reduce performance as expected, but also make performance almost insensitive to the complexity of the primary core across a diverse degrees of parallelism, which greatly reduces design complexity.
Keywords
processor scheduling; thermal management (packaging); manycore processor performance; thermal constraint; thermal impact; CMOS technology; Computer architecture; Computer science; Liquid cooling; Microchannel; Microprocessors; Moore´s Law; Parallel processing; Silicon; Transistors; Thermal impact; manycore; performance; processors; thermal constraint;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
Conference_Location
Santa Clara, CA
ISSN
1065-2221
Print_ISBN
978-1-4244-9458-3
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2010.5444293
Filename
5444293
Link To Document