DocumentCode :
2024217
Title :
Analysis on the causes of decline of MLCC insulation resistance
Author :
Jiang, Wei ; Hu, YongDa ; Bao, ShengXiang ; Lijie, Song ; Yuwei, Zheng ; Cui, Yongqiang ; Qiang, Li
Author_Institution :
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
fYear :
2015
fDate :
11-14 Aug. 2015
Firstpage :
1255
Lastpage :
1257
Abstract :
In this paper, based on the results of SEM and EDS analysis, I would like to share the discovery of MLCC failure due to insulation resistance. For external factors, The defects which caused by mechanical stress can lead to lack of insulation resistance. For the intrinsic factors, MLCC insulation resistance failure is due to the presence of defects, and the main defects include void in ceramic dielectric and delamination of porcelain body and inner electrode. These defects are difficult to analyze. With the help of SEM electron microscope detection, these defets can be see. The reason is the poor control of sintering process.In the test,these defects will cause the capacitor quickly form a conductive channel, finally lead to insulation resistance failure.
Keywords :
Capacitors; Ceramics; Electrodes; Immune system; Nonhomogeneous media; Failure analysis of MLCC; MLCC insulation resistance; SEM and EDS; decline of MLCC insulation resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
Type :
conf
DOI :
10.1109/ICEPT.2015.7236807
Filename :
7236807
Link To Document :
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