Title :
Thermal characteristics of TIMs with elliptical particles
Author :
Khiabani, Reza H ; Joshi, Yash ; Aidun, Cyrus K
Author_Institution :
G. W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
In this study, direct numerical simulations of suspended particles are used to characterize the heat transfer properties of TIMs. The computational method is based on the solution of a thermal lattice-Boltzmann method. Based on the simulations, the effect of particle parameters such as loading, thermal conductivity and size on the thermal resistance of the TIM can be predicted. The effect of particle shape is also considered. Elliptical particles with different aspect ratios are examined. Cylindrical particle is a special case with aspect ratio of 1. The results are compared with existing data. The results can be used to design TIM for better thermal performance.
Keywords :
heat transfer; lattice Boltzmann methods; numerical analysis; thermal conductivity; thermal resistance; TIM; computational method; cylindrical particle; direct numerical simulation; elliptical particles; heat transfer properties; particle parameter effect; particle shape effect; suspended particles; thermal conductivity; thermal lattice-Boltzmann method; thermal resistance; Computational modeling; Conducting materials; Electronic packaging thermal management; Heat transfer; Numerical simulation; Predictive models; Thermal conductivity; Thermal loading; Thermal resistance; Viscosity; Particle laden Thermal Interface Material; numerical simulation; suspended particles; thermal Lattice-Boltzmann method;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-9458-3
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2010.5444306
