DocumentCode
2024965
Title
[Copyright notice]
fYear
2010
fDate
21-25 Feb. 2010
Abstract
The following topics are dealt with: semiconductor thermal measurement; 3D packaging; micro-scale cooling; materials; green technologies; multi-core architecture; LED thermal management.
Keywords
environmental factors; light emitting diodes; temperature measurement; thermal management (packaging); LED; green technologies; light emitting diode; micro-scale cooling; multi-core architecture; semiconductor materials; thermal measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
Conference_Location
Santa Clara, CA
ISSN
1065-2221
Print_ISBN
978-1-4244-9458-3
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2010.5444328
Filename
5444328
Link To Document