Title :
[Copyright notice]
Abstract :
The following topics are dealt with: semiconductor thermal measurement; 3D packaging; micro-scale cooling; materials; green technologies; multi-core architecture; LED thermal management.
Keywords :
environmental factors; light emitting diodes; temperature measurement; thermal management (packaging); LED; green technologies; light emitting diode; micro-scale cooling; multi-core architecture; semiconductor materials; thermal measurement;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-9458-3
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2010.5444328
