Title :
A novel package approach for multichip modules based on anisotropic conductive adhesives
Author :
Heyen, Johann ; Jacob, Arne F.
Author_Institution :
EPCOS AG, Munich, Germany
Abstract :
In this paper anisotropic conductive pastes (ACP) are proposed for different level interconnections of millimeter-wave multichip modules (MCM) and packages. A novel ACP-based approach for cavity-up millimeter-wave packages simultaneously featuring small size, electrical and mechanical interconnection as well as heat transfer capabilities is presented.
Keywords :
adhesives; integrated circuit interconnections; integrated circuit packaging; millimetre wave integrated circuits; multichip modules; MCM; anisotropic conductive adhesives; anisotropic conductive pastes; electrical interconnection; heat transfer; mechanical interconnection; millimeter-wave multichip modules; millimeter-wave packages; multichip modules interconnections; Anisotropic magnetoresistance; Bonding; Conductive adhesives; Frequency; Integrated circuit interconnections; MMICs; Millimeter wave technology; Multichip modules; Packaging; Testing;
Conference_Titel :
Gallium Arsenide and Other Semiconductor Application Symposium, 2005. EGAAS 2005. European
Conference_Location :
Paris
Print_ISBN :
88-902012-0-7
