Simulation and testing of large-scale IC ceramic packages with differential routing

With the Semiconductor technology developing speedly, micro-electronic products have stepped into highly speed and frequency scope, coming with the challenges of micromation and lower power, etc. Digital circuit design is confronted with greater challenge. On one hand, the process technology of integrated circuits turn towards submicron-scale feature sizes, that results in pulse´s edge time descending to microsecond-level or even picoseconds-level. Meanwhile, the level of signals´ keep-time shortens seriously[1]. Based on differential routing principles, simulate software is applied on founding differential routing model. For comparison, simulation and testing methods are adopted to researching impedance of differential traces. Large-scale IC ceramic packages SPGA256 was used to differential impedance simulation and testing.