Title :
Silicon photonic link in CMOS quilt package
Author :
Zortman, William A. ; Trotter, Douglas C. ; Rohwer, Lauren E S ; Chu, Dahwey ; Hsia, Alexander H. ; Robertson, Gideon ; Greth, Doug ; Jarecki, Robert ; Sanchez, Carlos A. ; DeRose, Christopher T. ; Starbuck, Andrew L. ; Timon, Robert P. ; Davids, Paul S.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
A multifunction low-power, high-speed silicon photonic chip consisting of a resonant modulator and germanium detector is quilt packaged with CMOS receiver and driver electronics. Experimental data demonstrates this new route for intimate 2D-integration.
Keywords :
CMOS integrated circuits; chip scale packaging; elemental semiconductors; germanium; integrated optics; optical interconnections; optical modulation; photodetectors; silicon; CMOS quilt package; CMOS receiver; Ge; Si; driver electronics; germanium detector; high-speed silicon photonic chip; resonant modulator; silicon photonic link; CMOS integrated circuits; Detectors; Integrated circuit interconnections; Modulation; Packaging; Photonics; Silicon;
Conference_Titel :
Avionics, Fiber- Optics and Photonics Technology Conference (AVFOP), 2012 IEEE
Conference_Location :
Cocoa Beach, FL
Print_ISBN :
978-1-4577-0757-5
DOI :
10.1109/AVFOP.2012.6344073
