Title :
Manufacturing optically connected chips with photonic PWB assemblies
Author :
Thorson, Kevin ; Stevens, Rick ; Cazzell, Greg
Author_Institution :
Lockheed Martin Corp., Eagan, MN, USA
Abstract :
This presentation describes the technology in a commercial VITA VPX module form. VITA 48 documents the ruggedized VPX module version and conveniently describes the geometric constraints. Additionally, this module form- is a practical application of the technology because of the developing optical processing architectures and the available module optical backplane connections.
Keywords :
integrated optoelectronics; optical interconnections; printed circuits; VITA 48; commercial VITA VPX module; geometric constraints; module optical backplane connections; optical processing architectures; optically connected chips; photonic PWB assemblies; ruggedized VPX module version; High speed optical techniques; Optical device fabrication; Optical interconnections; Optical polymers; Optical waveguides;
Conference_Titel :
Avionics, Fiber- Optics and Photonics Technology Conference (AVFOP), 2012 IEEE
Conference_Location :
Cocoa Beach, FL
Print_ISBN :
978-1-4577-0757-5
DOI :
10.1109/AVFOP.2012.6344076
