Title :
Simulation of multi-chip module package resonance using commercial finite element electromagnetic software
Author :
Clark, Richard ; Agrawal, Ashok ; Miller, Stephen
Author_Institution :
Martin Marietta Gov. Electron. Syst., Moorestown, NJ, USA
Abstract :
Techniques have been developed to predict package resonance frequencies in multiple cavity, MMIC based, T/R modules, using the HP High Frequency Structure Simulator package. This method accounts for partially filled wave guide modes, perturbations due to GaAs MMICs and their metal spacers, and the effects of imperfect cavity end walls. Calculated results are compared to measured package resonances and module performance data
Keywords :
multichip modules; GaAs; HP High Frequency Structure Simulator package; MCM package resonance; MMIC based T/R modules; commercial finite element EM software; imperfect cavity end walls; metal spacers; multichip module package; multiple cavity modules; partially filled wave guide modes; perturbations; resonance frequencies; Electromagnetic scattering; Electronics packaging; Finite element methods; Frequency; Gallium arsenide; MMICs; Predictive models; Pulse width modulation; Resonance; Software packages;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594109
