DocumentCode
2025993
Title
Simulation of multi-chip module package resonance using commercial finite element electromagnetic software
Author
Clark, Richard ; Agrawal, Ashok ; Miller, Stephen
Author_Institution
Martin Marietta Gov. Electron. Syst., Moorestown, NJ, USA
fYear
1994
fDate
2-4 Nov 1994
Firstpage
121
Lastpage
123
Abstract
Techniques have been developed to predict package resonance frequencies in multiple cavity, MMIC based, T/R modules, using the HP High Frequency Structure Simulator package. This method accounts for partially filled wave guide modes, perturbations due to GaAs MMICs and their metal spacers, and the effects of imperfect cavity end walls. Calculated results are compared to measured package resonances and module performance data
Keywords
multichip modules; GaAs; HP High Frequency Structure Simulator package; MCM package resonance; MMIC based T/R modules; commercial finite element EM software; imperfect cavity end walls; metal spacers; multichip module package; multiple cavity modules; partially filled wave guide modes; perturbations; resonance frequencies; Electromagnetic scattering; Electronics packaging; Finite element methods; Frequency; Gallium arsenide; MMICs; Predictive models; Pulse width modulation; Resonance; Software packages;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594109
Filename
594109
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