Title :
Sustainable Embedded Software Life-Cycle Planning
Author :
Dong-hyun Lee ; In, H.P. ; Keun Lee ; Sooyong Park ; Hinchey, Mike
Abstract :
Time to market is a crucial factor in increasing market share in consumer electronics. Furthermore, fierce market competition tends to sharply lower the prices of new consumer electronics products as soon as they´re released. Researchers have studied software-intensive embedded system design methods, such as hardware/software co-design, with the goal of reducing development lead time by designing hardware and software simultaneously. However, most studies concentrate on static design methods, in which a design remains unchanged once it´s determined. To survive the market competition in consumer electronics requires a dynamic design strategy that takes various market conditions into account for software-intensive embedded systems. This article proposes a sustainable embedded software life-cycle planning (SeSLP) process based on the evolution of embedded software. The SeSLP process provides a dynamic method for both selecting product life-cycle design alternatives and generating a profit-maximizing transition plan that covers the entire product life cycle.
Keywords :
consumer electronics; electronics industry; embedded systems; hardware-software codesign; planning; production engineering computing; software engineering; sustainable development; SeSLP process; consumer electronics; dynamic design strategy; embedded software evolution; embedded system design method; hardware-software codesign; market competition; product life-cycle design alternative; profit-maximizing transition plan; software life-cycle planning; software-intensive embedded system; static design method; sustainable embedded software; time-to-market factor; Analytical models; Competitive intelligence; Consumer electronics; Market research; Marketing and sales; Product design; Software development; embedded software evolution; embedded systems; product life cycle; software engineering;
Journal_Title :
Software, IEEE