Title :
Packaging technologies for highly integrated 77 GHz automotive radar sensors
Author :
Mayer, Marcel ; Baur, Klaus ; Walter, Thomas
Author_Institution :
Inst. for Med. Eng. & Mechatron., Univ. of Appl. Sci. Ulm, Ulm, Germany
fDate :
Sept. 29 2009-Oct. 1 2009
Abstract :
The availability of SiGe with transit frequencies exceeding 200 GHz enables highly integrated and cost effective 77 GHz radar sensors for automotive applications. A major challenge for future radar generations is the development of an appropriate packaging technology. We propose a system in package approach (SIP) utilizing a SMD package without external 77 GHz connections. Beamforming is possible with dielectric lenses permitting the use of this modular concept in different automotive applications.
Keywords :
automotive electronics; road vehicle radar; system-on-package; automotive radar sensors; dielectric lenses; frequency 77 GHz; packaging technologies; system in package; Appropriate technology; Array signal processing; Automotive applications; Automotive engineering; Costs; Frequency; Germanium silicon alloys; Packaging; Radar applications; Silicon germanium;
Conference_Titel :
Microwave Conference, 2009. EuMC 2009. European
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4748-0
