Title :
Millimeter-wave MMIC interconnects using electromagnetic field coupling
Author :
Strauss, Georg ; Menzel, Wolfgang
Author_Institution :
Dept. of Microwave Techniques, Ulm Univ., Germany
Abstract :
Standard interconnect and packaging techniques for MMICs tend to get more and more difficult at mm-wave frequencies due to the increased influence of discontinuities and tolerances, especially in conjunction with temperature and hermetic sealing. To overcome these problems, a novel concept is proposed based on electromagnetic field coupling. First theoretical and experimental results are presented in this contribution
Keywords :
MIMIC; MMIC interconnects; discontinuities; electromagnetic field coupling; hermetic sealing; millimeter-wave MMIC; packaging techniques; substrate plane transmission lines; tolerances; Coplanar transmission lines; Electromagnetic coupling; Electromagnetic fields; Frequency; Gallium arsenide; Integrated circuit interconnections; MMICs; Microstrip; Packaging; Transmission line theory;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594115
