DocumentCode
2028109
Title
A novel approach to assembly and interconnection for micro electro mechanical systems
Author
Suga, T. ; Hosoda, N.
fYear
1995
fDate
29 Jan-2 Feb 1995
Firstpage
413
Keywords
Assembly systems; Bonding forces; Chemical technology; Diffusion bonding; Mechanical systems; Micromachining; Surface cleaning; Temperature; Thermal stresses; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE
Print_ISBN
0-7803-2503-6
Type
conf
DOI
10.1109/MEMSYS.1995.472589
Filename
472589
Link To Document