DocumentCode :
2028256
Title :
Optoelectronic Packaging Technology For Datacommunications Present And Future
Author :
Oprysko, Mtdest M.
Author_Institution :
IBM Research Division
fYear :
1992
fDate :
16-19 Nov 1992
Firstpage :
435
Lastpage :
436
Keywords :
Assembly; Boring; Consumer electronics; Electronics packaging; Fiber lasers; Gallium arsenide; Optical arrays; Optical fibers; Optical waveguides; Waveguide lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
LEOS '92, Conference Proceedings. IEEE Lasers and Electro-Optics Society, 1992 Annual Meeting
Print_ISBN :
0-7803-0526-4
Type :
conf
DOI :
10.1109/LEOS.1992.694030
Filename :
694030
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2028256
