DocumentCode
2028776
Title
A materials database for microwave packaging design
Author
Harris, H.M. ; Rucker, C.T. ; Farley, J.R.
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
fYear
1994
fDate
2-4 Nov 1994
Firstpage
151
Lastpage
153
Abstract
A joint services project to develop a microwave materials database is described. The major goal is to improve the availability of accurate data on the “high tech materials” needed for cost-effective production of microwave packages
Keywords
integrated circuit packaging; availability; cost-effective production; high tech materials; joint services project; materials database; microwave packaging design; Aerospace materials; Assembly; Databases; Electromagnetic heating; Electronics packaging; Integrated circuit packaging; Semiconductor device packaging; Temperature; Thermal conductivity; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594122
Filename
594122
Link To Document