DocumentCode
2028850
Title
A network modeling approach for effects of metallic packages on microstrip circuit performance
Author
Gupta, K.C.
Author_Institution
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
fYear
1994
fDate
2-4 Nov 1994
Firstpage
159
Lastpage
162
Abstract
“Hot-spots” on a circuit layout are identified and modeled as multiport planar components, and a “package-network” characterized by an admittance-matrix is connected to additional ports on these “hot-spot” components. The approach has been verified by evaluating interactions among microstrip discontinuities in a rectangular package
Keywords
microstrip circuits; admittance-matrix; circuit layout; hot-spot components; metallic packages; microstrip circuit performance; microstrip discontinuities; multiport planar components; network modeling; rectangular package; Admittance; Analytical models; Circuit analysis; Circuit optimization; Circuit simulation; Computational modeling; Electromagnetic analysis; Electronics packaging; Microstrip; Microwave circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594126
Filename
594126
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