Title :
A network modeling approach for effects of metallic packages on microstrip circuit performance
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
Abstract :
“Hot-spots” on a circuit layout are identified and modeled as multiport planar components, and a “package-network” characterized by an admittance-matrix is connected to additional ports on these “hot-spot” components. The approach has been verified by evaluating interactions among microstrip discontinuities in a rectangular package
Keywords :
microstrip circuits; admittance-matrix; circuit layout; hot-spot components; metallic packages; microstrip circuit performance; microstrip discontinuities; multiport planar components; network modeling; rectangular package; Admittance; Analytical models; Circuit analysis; Circuit optimization; Circuit simulation; Computational modeling; Electromagnetic analysis; Electronics packaging; Microstrip; Microwave circuits;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594126
