DocumentCode
2029089
Title
A low cost, multilayer, thick film based, T/R module package for phased array applications
Author
Miller, Stephen ; Miller, Alex ; Clark, Richard
Author_Institution
Martin Marietta Gov. Electron. Syst., Moorestown, NJ, USA
fYear
1994
fDate
2-4 Nov 1994
Firstpage
163
Lastpage
166
Abstract
Low cost T/R module packaging is a cornerstone of economical active phased array technology. This paper describes an MMIC-based T/R module which includes composite metal matrix baseplate, multi-layer thick film substrate, soldered metal seal wall, and unique RF transitions, which provided a low cost solution for a C-band active array application. Emphasis is placed on the RF feed-through design and the packaging material choices
Keywords
integrated circuit packaging; C-band active array; MMIC-based T/R module; RF feedthrough design; RF transitions; T/R module package; composite metal matrix baseplate; low cost type; multilayer thick film substrate; packaging materials; phased array applications; soldered metal seal wall; thick film based module package; Copper; Costs; Dielectric substrates; Electronics packaging; Metallization; Nonhomogeneous media; Phased arrays; Radio frequency; Seals; Thick films;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594128
Filename
594128
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