Title :
Cofiring process for glass-Ceramic/copper multilayer ceramic substrate
Author :
Master, R.N. ; Herron, L.W. ; Tummala, R.R.
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Abstract :
The authors describe the unique challenges and solutions in cofiring glass-ceramic and copper to form a dense package with desired mechanical and electrical properties. A patented steam sintering process has been developed that is based on sound theoretical background. This process has allowed packaging of a low-dielectric-constant ceramic with a high-conductivity copper conductor with desired electrical and mechanical properties
Keywords :
ceramics; composite materials; glass-metal seals; packaging; cofiring process; dense package; high conductivity Cu conductor; low permittivity ceramics; low-dielectric-constant ceramic; multilayer ceramic substrate; steam sintering process; Atmosphere; Ceramics; Conductivity; Copper; Dielectric constant; Nonhomogeneous media; Packaging; Substrates; Temperature; Thick films;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163843
