A thin films on MLC application

Author

Leung, George B. ; Sands, Scott A.

Author_Institution

IBM Corp., Hopewell Junction, NY, USA

fYear

1991

fDate

11-16 May 1991

Firstpage

10

Lastpage

13

Abstract

The ability to create and process thin-film metal patterns directly on a multilayer ceramic (MLC) substrate has been demonstrated. The direct patterning of an MLC substrate with thin-film metallurgy enhances the substate by minimizing the number of layers required for device grid redistribution and increasing the device interconnection capability. It affords process simplification and good manufacturability as a result. The System 390-Air Cooled Thermal Conduction Module is a multidevice module with thin-film metallurgy that provides interconnection for a 10×10 device array in the test vehicle format and an 11×11 device array in the product format. The authors describe the thin film process

Keywords

ceramics; hybrid integrated circuits; metallisation; substrates; MLC application; MLC substrate; System 390; Thermal Conduction Module; air cooled modules; device interconnection capability; direct patterning; manufacturability; multichip modules; multidevice module; multilayer ceramic; product format; test vehicle format; thin film process; thin-film metal patterns; thin-film metallurgy; Capacitors; Ceramics; Dielectric substrates; Dielectric thin films; Metallization; Rough surfaces; Surface roughness; Surface treatment; Thin film devices; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163844

Filename

163844