Title :
Copper polyimide multilayer substrate for high speed signal transmission
Author :
Kambe, Rokuro ; Kuroda, Masao ; Imai, Ryuji ; Kimura, Yukihiro
Author_Institution :
NGK Spark Plug Co. Ltd., Aichi Prefecture, Japan
Abstract :
Copper-polyimide substrate has been developed for high-speed signal transmission use. This substrate is combined with thick-film cofired technology and thin-film multilayer technology, and it is effective for higher-density packaging use. By using copper-polyimide multilayer substrate with tight tolerance cofired alumina ceramics in conjunction with highly conductive internal metallization, electrical performance in the high-frequency region has been improved. The results of environmental reliability tests and high-frequency evaluations indicate that these products are ready for application
Keywords :
copper; environmental testing; hybrid integrated circuits; metallisation; polymer films; substrates; Cu polyimide substrates; cofired alumina ceramics; conductive internal metallization; electrical performance; environmental reliability tests; high speed signal transmission; multilayer substrate; thick-film cofired technology; thin-film multilayer technology; Ceramics; Copper; Large scale integration; Nonhomogeneous media; Packaging; Polyimides; Propagation delay; Resistors; Substrates; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163845
