Copper polyimide multilayer substrate for high speed signal transmission

Author

Kambe, Rokuro ; Kuroda, Masao ; Imai, Ryuji ; Kimura, Yukihiro

Author_Institution

NGK Spark Plug Co. Ltd., Aichi Prefecture, Japan

fYear

1991

fDate

11-16 May 1991

Firstpage

14

Lastpage

19

Abstract

Copper-polyimide substrate has been developed for high-speed signal transmission use. This substrate is combined with thick-film cofired technology and thin-film multilayer technology, and it is effective for higher-density packaging use. By using copper-polyimide multilayer substrate with tight tolerance cofired alumina ceramics in conjunction with highly conductive internal metallization, electrical performance in the high-frequency region has been improved. The results of environmental reliability tests and high-frequency evaluations indicate that these products are ready for application

Keywords

copper; environmental testing; hybrid integrated circuits; metallisation; polymer films; substrates; Cu polyimide substrates; cofired alumina ceramics; conductive internal metallization; electrical performance; environmental reliability tests; high speed signal transmission; multilayer substrate; thick-film cofired technology; thin-film multilayer technology; Ceramics; Copper; Large scale integration; Nonhomogeneous media; Packaging; Polyimides; Propagation delay; Resistors; Substrates; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163845

Filename

163845