Title :
DC to 100 GHz chip-to-chip interconnects with reduced tolerance sensitivity by adaptive wirebonding
Author_Institution :
Deutsche Aerospace AG, Ulm, Germany
Abstract :
Equivalent network analysis of short double-wire interconnects including proximity effects yields a simple but accurate model for broadband compensation-network design. Inductance-invariance equations are derived and readily implemented into an image-controlled wirebonding machine for neutralizing diebond tolerances
Keywords :
integrated circuit interconnections; 0 to 100 GHz; adaptive wirebonding; broadband compensation-network design; chip-to-chip interconnects; equivalent network analysis; image-controlled wirebonding machine; inductance-invariance equations; proximity effects; short double-wire interconnects; tolerance sensitivity reduction; Bonding; Equivalent circuits; Impedance; Integrated circuit interconnections; Proximity effect; RF signals; Radio frequency; Semiconductor device measurement; Shape measurement; Substrates;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594136
