• DocumentCode
    2029932
  • Title

    Interconnect characterization using time domain reflectometry

  • Author

    Corey, Steve ; Yang, Andrew T.

  • Author_Institution
    Washington Univ., Seattle, WA, USA
  • fYear
    1994
  • fDate
    2-4 Nov 1994
  • Firstpage
    189
  • Lastpage
    191
  • Abstract
    An approach is presented for macromodeling interconnect circuitry based on measured time domain reflectometry (TDR) data. In two example circuits which are macromodeled, delay, reflection, transmission, and crosstalk are accurately simulated as compared to measured data
  • Keywords
    time-domain reflectometry; TDR data; crosstalk; delay; interconnect characterization; macromodeling; reflection; time domain reflectometry; transmission; Circuit simulation; Coupling circuits; Crosstalk; Delay; Frequency; Integrated circuit interconnections; Packaging; Reflectometry; Solid modeling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-2411-0
  • Type

    conf

  • DOI
    10.1109/EPEP.1994.594139
  • Filename
    594139
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2029932